Dual-Interface Card Inlay (CPU Prelam)
Are you laminating, converting, or embedding RFID into your own final product?
- MOQ
- 1,000 sheets
- Lead time
- 30–45 days
- Samples
- Stock or custom
Entry tier. Then: samples on approval.
Standard; rush possible on request.
Fees, freight and credits follow the sample policy.
Use this inlay or prelam when your team handles the lamination, die-cutting, or embedding step in-house. Confirm antenna geometry, chip family, pitch / roll format, and release-liner compatibility with your laminator before ordering sample rolls.
- Exact quote within 24 hours (Mon–Fri, GMT+8)
- Artwork PDF proof — bulk production starts only after your sign-off
- Stock and custom sample terms are confirmed before shipment
What buyers usually confirm first
swipe →Spec Check
What to confirm in the spec sheet
These specifications help buyers decide whether the product belongs on the sample shortlist before they move into deeper review.
| Product Name | Dual-Interface CPU Card Inlay |
| Contactless Frequency | 13.56MHz (ISO/IEC 14443) |
| Contact Interface | ISO/IEC 7816 |
| Chip Options | NXP SmartMX, JCOP Java Card, G+D Sm@rtCafe and other DI CPU modules |
| Substrate | PVC, PET, PC, PETG |
| Antenna Sizes | 520-410, 490-310, 470-390, 600-380 mm |
| Thickness | 0.40-0.02 mm (minimum 0.35 mm) |
| Layouts | 5-5, 4-8, 3-8 (spacing customizable) |
| Bonding Process | Tin-slice, conductive adhesive, pickline; automatic spot-welding |
| Quality Control | 100% electrical test (contact + contactless) per unit; ISO 9001: 2015 |
| MOQ | 1,000 sheets; samples on approval |
| Lead Time | 30-45 business days |
Shortlist Logic
Why buyers keep this option in play
These product traits often decide whether the format should move from browsing into a real sample plan.
Use Cases
Where this product format usually fits
These common deployments help buyers judge whether the product belongs in the right sample batch.
EMV dual-interface banking and payment cards
Government and national eID credentials
Public-transport CPU fare cards
Health-insurance and social-security cards
Secure corporate and campus identity cards
Loyalty programs on CPU / Java Card platforms
Dual-Interface Card Inlay (CPU Prelam) Types
1Dual-interface inlay specifications
Contactless frequency 13.56MHz (ISO/IEC 14443); contact interface ISO/IEC 7816. Materials PVC, PET, PC, PETG. Antenna sizes 520-410, 490-310, 470-390, 600-380 mm. Thickness 0.40-0.02 mm, minimum 0.35 mm. Layouts 5-5, 4-8, 3-8 with customizable spacing. Chips: NXP SmartMX, JCOP Java Card, G+D and other dual-interface CPU modules.
2Bonding processes
RFIDAK offers three connection methods between antenna and contact module: tin-slice (solder), conductive adhesive, and pickline. The wire is laid so no coil pattern telegraphs through the finished surface, and automatic spot-welding replaces hand-soldering to avoid the static-induced chip damage that shortens card life. The result laminates flat with stable contact and contactless performance.
3Four ways to join the module to the antenna
Everything difficult about a dual-interface card happens at one joint: where the ISO 7816 contact module meets the antenna terminals. There are four production answers, and the right one depends on your card body and your durability target.
If you are not sure which one your programme needs: soldering for maximum conductivity on PVC, conductive adhesive for heat-sensitive bodies, landing pads if you want the simplest integration, close coupling when bend durability is the specification you have to pass.
4Where the antenna terminals land on the sheet
The antenna is positioned so its terminals meet the contact module without the coil interfering with the RF field, and the wire is deployed so no coil pattern shows through the finished card surface.
Antenna sizes 520×410, 490×310, 470×390 and 600×380 mm; thickness 0.40 ± 0.02 mm with a 0.35 mm floor; layouts 5×5, 4×8 and 3×8 with customisable spacing to match your milling window.
5Contact and contactless are both tested, on every unit
A dual-interface inlay has two ways to fail, so it gets two tests. Both interfaces are verified per unit before the sheet is released.
| What is checked | Instrument | Coverage |
|---|---|---|
| Chip response and read/write | Multi-chip test platform with reader and terminal | 100% of units |
| Antenna resonance frequency | Bode 100 vector network analyser | Setup + in-process |
| Inlay thickness | Digital height gauge | Per sheet lot |
| Chip-to-antenna bond strength | Push-force instrument | Per shift |
| Bond joint condition | Stereo microscope | Per shift |
| Substrate identity and density | Precision density balance | Incoming material (IQC) |
| Ageing and lamination survival | Constant temperature and humidity chamber | Qualification + periodic |
Bond strength is the measurement that matters most here — a joint that passes electrically today and opens after 500 flex cycles is the classic dual-interface field failure. Push-force testing per shift is how we catch a drifting weld before it ships.
6From PVC sheet to tested prelam — six stages
Dual-interface CPU inlays add module bonding and a second test pass, which is why lead time runs 30–45 days rather than 10–15.
How Ordering Works
From inquiry to delivered dual-interface card inlay (cpu prelam) in four steps
The same process every order follows — you always see a proof and approve it before anything goes to production.
- 1Within 24 hours
Send your inquiry
Share quantity, chip and application — or send the configuration straight from the estimate above. We reply with an exact quote and a chip / format recommendation.
- 21–3 days
Samples & artwork proof
Stock samples may be free under the sample policy; freight, custom-sample fees and any credits are confirmed before shipment. Test compatibility and finish before bulk approval.
- 3You control the clock
Approve the proof
Bulk production starts only after your written sign-off on the proof, chip encoding plan and numbering / UID list. Revisions before approval are free.
- 47–15 business days
Production & delivery
Standard lead time for stock tooling (custom molds add time — confirmed on your quote), then door-to-door express with tracking to your office or warehouse.
Details in writing:sample policy ·shipping & Incoterms ·quality control process
Supplier Fit
Why buyers source Dual-Interface Card Inlay (CPU Prelam) from RFIDAK
Once the format is right, most teams still need confidence in manufacturing control, sample support, and repeat-order reliability.
Quality-focused manufacturing and sample support for custom RFID projects.
RFID manufacturing experience across cards, tags, labels, wristbands and readers.
Test compatibility before bulk approval; stock and custom sample terms follow the published sample policy.
Next Reading
What to read before you lock the sample path
These references help buyers move from broad browsing into a tighter shortlist before they send project details.
Nearby Options
Compare nearby options before you narrow the shortlist
These related products help buyers keep close alternatives in view before they commit to a sample direction.
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Compare this optionBefore You Order
Procurement guides every Card Inlay buyer reads first
Five short reads on the procurement-side topics every B2B RFID buyer wants answered before signing a quote — MOQ thresholds, lead time reality, pricing transparency, sample policy, and how to audit a Chinese factory before your first order.
Buyer Questions
Questions buyers usually ask before sample approval
These FAQs cover the points that usually come up between a first shortlist and a real sample or quote request.
What is the minimum order quantity (MOQ) for Dual-Interface Card Inlay (CPU Prelam)?+
For Dual-Interface Card Inlay (CPU Prelam), the published MOQ is 1,000 sheets; samples on approval. Exact MOQ and unit pricing are quoted per project once chip, customization and packaging are confirmed.
Does RFIDAK provide free samples of Dual-Interface Card Inlay (CPU Prelam)?+
Yes. Stock card inlay samples of Dual-Interface Card Inlay (CPU Prelam) are typically free; we only ask buyers to cover DHL/FedEx express shipping. Samples ship in 1–3 business days after your order is confirmed and arrive in 2–5 days to most countries. Custom samples (new chip, new size, printed artwork) usually take 3–7 additional days.
What is the production lead time for Dual-Interface Card Inlay (CPU Prelam)?+
Published lead time for Dual-Interface Card Inlay (CPU Prelam) is 30–45 business days. The clock starts at PO confirmation and artwork approval, not at your first inquiry. Rush production is available on request for time-sensitive launches; confirm MOQ and artwork early to protect the timeline.
Can Dual-Interface Card Inlay (CPU Prelam) be customized for my brand or project?+
Yes. Dual-Interface Card Inlay (CPU Prelam) supports end-to-end customization: full-color CMYK / silk-screen / UV printing, laser engraving, serial numbering, custom chip encoding (UID write, NDEF, sector locking), custom shape / size (subject to tooling MOQ), and packaging. Share your artwork, chip requirement and quantity and we will return a spec sheet + price within 24 hours.
Which RFID chips are supported for Dual-Interface Card Inlay (CPU Prelam)?+
Dual-Interface Card Inlay (CPU Prelam) supports NXP SmartMX, JCOP Java Card, G+D Sm@rtCafe and other DI CPU modules. Before ordering, share your reader model or current credential so we can confirm the exact chip variant (e.g., MIFARE Classic 1K vs DESFire EV3, NTAG213 vs 215) and avoid compatibility issues after lamination.
What certifications and quality control does RFIDAK apply to Dual-Interface Card Inlay (CPU Prelam)?+
RFIDAK operates under ISO 9001:2015, ISO 14001:2015 and ISO 45001:2018 management systems, certified by Anhui Certification and Inspection Co., Ltd. Dual-Interface Card Inlay (CPU Prelam) is subject to incoming material inspection, in-process QC at every lamination / bonding / encoding step, and 100% electrical performance testing before shipment. Products meet CE, FCC, RoHS and REACH as applicable by market. Full test reports are available on request for buyer audits.
Can Dual-Interface Card Inlay (CPU Prelam) be pre-encoded or printed with my artwork before shipment?+
Yes. Dual-Interface Card Inlay (CPU Prelam) can ship with UID range assignment, NDEF URL encoding (for NFC), sector-locked user data, serial numbering, and CMYK / silk-screen / UV printing of your artwork. Provide an AI/PDF artwork file at 300 dpi with 3 mm bleed and a chip-encoding spec; we return a digital proof for approval before production.
How does RFIDAK ship Dual-Interface Card Inlay (CPU Prelam) internationally?+
RFIDAK ships Dual-Interface Card Inlay (CPU Prelam) via DHL / FedEx / UPS (door-to-door, 3–5 days to most countries), air cargo (5–7 days for heavier orders), or sea freight (20–35 days for bulk over 500 kg). Standard Incoterms are EXW, FOB Shenzhen and DDP; choose based on customs clearance preferences. Commercial invoice, packing list and CoC / MSDS are included automatically.
How does RFIDAK handle repeat orders of Dual-Interface Card Inlay (CPU Prelam)?+
For repeat buyers, RFIDAK locks tooling, artwork and chip encoding on file so subsequent POs ship faster — typically 5–10 business days for stock chip types at previously-run quantities. Price is adjusted transparently per chip market rate and FX movement; we flag any chip shortage (e.g., DESFire EV3) before quotation so the project plan stays realistic.
Get Free RFID Samples
Try before you buy. Request free samples of any RFID product from our 50+ SKU catalog. Samples shipped via DHL/FedEx within 1-3 business days worldwide.
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