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Product selection · 9 catalog options

RFID Card Inlays & Prelam Sheets for Card Production

A card inlay is a semi-finished chip-and-antenna assembly for a card producer to integrate into a finished card. Specify the supplied stage, exact chip, sheet layout and complete card stack. LF, HF, UHF, multi-chip and dual-interface designs need different integration checks; a bare-inlay read does not establish performance after lamination and punching.

Review my card stackExplore the range
White prelam sheet with two rows of five rectangular inlay positions.
RFID Card Inlays — LF, HF & UHFOne format from the range. Confirm the selected model and configuration.

Before choosing a model

Compare the decisions that change the specification.

Inlay and prelam terminology can describe different supplied assemblies. Agree whether the order is an antenna sheet, chip-equipped inlay, prelam or a dual-interface module integration stage. Identify which party performs each remaining process and how the completed card will be accepted.

Specify architecture and assembly stage separately, then validate the finished card.
Inlay familyArchitectureInformation to approveFinished-card validation
LF card inlaySelected LF chip and coilExact protocol, identifier interpretation and card stackUse on the intended reader; no blanket animal-ID or access-system compatibility
HF card inlaySelected HF chip and antennaChip family, protocol, memory, application and antenna layoutRequired card commands or authorized application after processing
UHF card inlayUHF chip and antennaRegion, reader, EPC format, inlay geometry and current chip supplyRead zone and encoded data in the intended card holder and position
Dual-frequency inlayTwo selected RF bandsExact chip pair, independent identifiers and antenna arrangementBoth interfaces after lamination and punching
Combi inlayMultiple chip functions in an approved designEach chip, interface, position and explicit data mappingEach function; agree whether one failure rejects the whole card
Dual-interface CPU inlayCompatible contact and contactless CPU module integrationModule, OS, connection or coupling method and supplied assembly stageBoth interfaces and the issuer-defined application; no automatic payment approval
Prelam sheet or irregular inlayDefined sheet assembly or custom die lineComplete stack, reference marks, chip clearance and cutting boundaryFinished nests or shapes after the buyer's actual conversion process

Checks before approving a sample

  • Keep dual-frequency, combi and dual-interface terminology separate. Multiple independent RF chips do not by themselves make a dual-interface CPU card.
  • Catalog layouts such as 2 × 5 through 6 × 8 are drawing references, not guaranteed usable yield. Confirm margins, pitch, reject marking and delivered units.
  • Record lamination temperature, pressure, dwell and cooling, then punching and module-integration steps. Approve samples using the intended full stack.
  • Agree the actual electrical test method and acceptance records. A supplier's process description or chip certificate cannot establish the finished card's approval.

Define the supplied assembly

Identify the chip, antenna, substrate, layer stack and any module integration still required by the card producer.

Approve the sheet drawing

Confirm usable area, nests, pitch, reference marks, margins and punching clearance rather than a layout count alone.

Validate after conversion

Test the buyer's laminated and punched cards. Agree electrical checks, defect marking and acceptance records for the supplied sheets.

Explore the range

Card Inlay: model information and sample checks

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From shortlist to sample

Match the supplied inlay to your card process

Send the chip, assembly stage, sheet drawing and complete card stack. We can review the integration, sample-sheet plan and acceptance requirements before quoting production.

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Include these details

  • Exact chip, reader protocol and finished-card application; for a CPU design include module, OS and issuer requirements.
  • Supplied assembly stage and the responsibility for antenna connection, module insertion, lamination and personalization.
  • Sheet drawing, usable positions, substrate, complete thickness, antenna geometry and the proposed lamination and punching process.
  • Sample sheets, production sheets and usable inlays per sheet, plus electrical-test, defect-marking and delivery requirements.

Sample termsShipping and delivery planning

Buying questions

What to confirm before you order.

Use the selected model’s information and an agreed sample test for the final decision.

Do I need an inlay, a prelam sheet or finished cards?

Choose the supplied stage according to the processes you can perform. An inlay or prelam still needs a defined conversion process, which can include lamination, punching and module integration. A desktop card printer alone does not perform those stages. If you need printed cards ready for your issuance workflow, start with finished RFID cards instead.

Are dual-frequency, combi and dual-interface inlays the same?

No. Dual-frequency describes interfaces in different RF bands. Combi describes multiple chip functions according to the card design. A dual-interface CPU card provides contact and contactless communication through a compatible CPU module and antenna arrangement. Specify every chip and interface, including the stage at which the module is supplied or integrated.

What sheet dimensions and layout should I request?

Supply a drawing with sheet dimensions, usable area, card nests, pitch, registration marks, margins and punching clearance. Catalog examples include 2 × 5 through 6 × 8 layouts, but the actual stack and geometry need approval. Quote production sheets and usable inlays explicitly so a layout label is not mistaken for guaranteed finished-card yield.

How should electrical testing and rejects be agreed?

Define the test operation, equipment or setup, acceptance limits, sampling or inspection coverage and position-level reject marking in the order. Ask for the records applicable to the supplied lot. An incoming chip response does not establish successful lamination, punching or final application performance; validate those separately on converted samples.

Does a dual-interface inlay automatically meet payment or eID requirements?

No. Contact and contactless interface support alone does not establish approval by a payment scheme, issuer or government program. Confirm the exact CPU module, operating system, application, integration method and required approvals with the responsible issuer. A module-family or Java Card reference is not a complete approved card specification.

How are sample quantity, MOQ and production timing defined?

Quote engineering samples, sample sheets, production sheets and usable inlay quantities separately. Confirm the exact chip supply, substrate, assembly stage, tooling and acceptance requirements, then agree MOQ and timing for that configuration. Keep conversion and finished-card acceptance in the schedule before releasing a repeat order.

Continue your selection

Related buying guides

Card inlay specification guide

Define supply format, chip, stack and the card producer's integration responsibilities.

Dual-interface CPU integration

Separate module, interface and issuer requirements from the supplied prelam.

Prelam sheet drawing and acceptance

Agree usable positions, registration, defect marking and units in the quote.

Finished RFID cards

Choose this route when you need finished card bodies rather than semi-finished assemblies.

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